锐峰先科技术有限公司

Optimized plasma FIB-SEM platform for high-quality deprocessing of the most modern semiconductor devices with proprietary chemistries

 

• Low-kV high-resolution imaging with enhanced topographic contrast of target layers

• Imaging of edges of delayered or cleaved chips using field-free high-resolution technology

• Dedicated and proprietary gas chemistries for sub-14 nm nodes deprocessing

• End-pointing software module for semiautomated deprocessing enables stopping the process at a desired layer

• Electrical characterization of the most sensitive semiconductor devices using in-situ nanoprobing

• Easy-to-use, fully customizable, applicationoriented and modular user interface